Distinct from traditional heuristic solvers, this paper on one hand proposes an RL-based model for mixed-size macro placement, which differs from existing learning-based placers that often consider the macro by coarse grid-based mask. While the standard cells are placed via gradient-based GPU acceleration. On the other hand, a one-shot conditional generative routing model, which is composed of a special-designed input-size-adapting generator and a bi-discriminator, is devised to perform one-shot routing to the pins within each net, and the order of nets to route is adaptively learned.

Being still in its early stage, there are fundamental issues: scalability,reward design, and end-toend learning paradigm etc.

The development of very large-scale integration (VLSI) technology has posed new challenges for electronic design automation (EDA) techniques in chip floorplanning. During this process, macro placement is an important subproblem, which tries to determine the positions of all macros with the aim of minimizing half-perimeter wirelength (HPWL) and avoiding overlapping. Previous methods include packing-based, analytical and reinforcement learning methods. In this paper, we propose a new black-box optimization (BBO) framework (called WireMask-BBO) for macro placement, by using a wire-mask-guided greedy procedure for objective evaluation. Equipped with different BBO algorithms, WireMask-BBO empirically achieves significant improvements over previous methods, i.e., achieves significantly shorter HPWL by using much less time. Furthermore, it can fine-tune existing placements by treating them as initial solutions, which can bring up to 50% improvement in HPWL. WireMask-BBO has the potential to significantly improve the quality and efficiency of chip floorplanning, which makes it appealing to researchers and practitioners in EDA and will also promote the application of BBO.

In modern chip design, placement aims at placing millions of circuit modules, which is an essential step that significantly influences power, performance, and area (PP A) metrics.

Previous methods include packing-based, analytical and reinforcement learning methods.

Distinct from traditional heuristic solvers, this paper on one hand proposes an RL-based model for mixed-size macro placement, which differs from existing learning-based placers that often consider the macro by coarse grid-based mask. While the standard cells are placed via gradient-based GPU acceleration. On the other hand, a one-shot conditional generative routing model, which is composed of a special-designed input-size-adapting generator and a bi-discriminator, is devised to perform one-shot routing to the pins within each net, and the order of nets to route is adaptively learned.

This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow supports modular integration of 3D partitioning, placement, 3D routing, RC extraction, and thermal simulation, aligning with advanced 3D flows that rely on commercial tools and in-house scripts. We present two foundational 3D placement algorithms: Open3D-Tiling, which emphasizes regular macro placement, and Open3D-DMP, which enhances wirelength optimization through cross-die co-placement with analytical placer DREAMPlace. Experimental results show significant improvements in area (51.19%), wirelength (24.06%), timing (30.84%), and power (5.72%) compared to 2D flows. The results also highlight that better wirelength does not necessarily lead to PPA gain, emphasizing the need of developing PPA-driven methods. Open3DBench offers a standardized, reproducible platform for evaluating 3D EDA methods, effectively bridging the gap between open-source tools and commercial solutions in 3D-IC design.